Showing posts with label drc fixes. Show all posts
Showing posts with label drc fixes. Show all posts

Design Rule Checks (DRC)

 

Design Rule Check (DRC) in VLSI Physical Design

1. What is DRC?

Design Rule Check (DRC) is a physical verification process that ensures the layout follows the foundry-defined design rules for manufacturability. These rules define the minimum width, spacing, via enclosures, and other geometric constraints to prevent fabrication defects.

Goal: Ensure that the layout is manufacturable and error-free, preventing yield loss and chip failures.


2. Why is DRC Important?

✔ Ensures the design meets fabrication constraints.
✔ Prevents short circuits, open circuits, and yield loss.
✔ Ensures higher reliability and better performance.
✔ Helps achieve a DRC-clean layout, avoiding costly silicon failures.


3. Common DRC Rules

1. Width Rules

  • Defines minimum width for metals, poly, diffusion, etc.
  • Ensures wires are not too thin, preventing high resistance and breaks.

Example: Minimum metal width = 0.07µm


2. Spacing Rules

  • Defines minimum spacing between two metal layers to avoid shorts.
  • Helps reduce crosstalk and noise.

Example: Minimum spacing between metal lines = 0.08µm


3. Via & Contact Rules

  • Ensures vias are large enough and correctly enclosed by metal layers.
  • Prevents high resistance, electromigration, and open circuits.

Example:
✔ Via enclosure rule: Via must be enclosed by metal on all sides by 0.02µm


4. Overlap & Extension Rules

  • Ensures proper overlap between layers to avoid open circuits.
  • Prevents alignment errors during manufacturing.

Example:
Poly must extend over active diffusion by 0.05µm


5. Density Rules (CMP Check)

  • Ensures uniform metal density to avoid dishing or erosion during Chemical Mechanical Polishing (CMP).
  • Uses dummy metal fill to balance density.

Example: Minimum metal density in any region must be > 30%


6. Antenna Rules

  • Checks for antenna effect, which can damage transistors during fabrication.
  • Prevents excessive charge buildup on long interconnects.

Solution: Use antenna diodes or metal jumpers to higher layers.


4. DRC Flow (Step-by-Step Process)

Step 1: Run DRC tool (Calibre, IC Validator, Assura).
Step 2: Identify violations (errors in spacing, width, etc.).
Step 3: Debug and fix errors in the layout.
Step 4: Rerun DRC until the design is DRC-clean.


5. DRC Errors & Fixes

DRC Error Cause Solution
Width Violation Metal/poly/diffusion too narrow Increase width
Spacing Violation Two metals too close Increase spacing
Via Enclosure Violation Via not enclosed properly Adjust via enclosure
Antenna Violation Long metal paths causing charge buildup Add antenna diode
Density Violation Uneven metal distribution Add dummy metal fills

6. DRC Verification Tools

🔹 Calibre DRC (Siemens/Mentor Graphics)
🔹 IC Validator (Synopsys)
🔹 Assura DRC (Cadence)
🔹 PVS DRC (Cadence)